Electrical grounding-clamp.



I. E. BIRDSALL.

LECTRICAL GROUNDING CLAMP. APPLICATION FILED AUG. l'. |915.

PatentedMar. 13, 1917.

WITNESSES.'

JAMES ELBERT' -BIItDsALn or PHILADELPHIA, rnivivsYLvAnIA, Assrsnonj'ro Y WILLIAM eIBson.

ELECTRICAL GROUNDING-CLAIVIP.

Specification of Letters Patent.

Patented Mar. I3, 1917.

Application led August 17, 1915. Serial No. 45,946.

To all whom t may-concern.' Y

Be it known that I, JAMns Ennnnr BIRD- cuits, and? has for its objects to provide',

first, a reliable and efficient device for connecting, both mechanically and electrically, the circuit with a pipe or conduit or other grounded conductor, and second, a ready means for securelyattaching and retaining the same in position, whereby all tendency to loosening or shifting may be obviated.

For the purpose of illustrating my invention I have described and shown in the accompanying drawings one form thereof which is at present preferred by me, although it is to be understood that the various instrumentalities of which my invention consists can be variously arranged and organized and that my invention is not to be limited to the precise form, arrangement, and organization as herein shown and described except as may be limited by the claims.

Figure l, is a plan view ofmy invention; Fig. 2, a longitudinalv section. on line Fig. 3, an end view of it attached toa conductor; Fig. 4, a transverse section on line y-y; and Fig. 5, a plan view of a modication showing channels before application of solder. `Similar numerals refer to similar parts throughout the several views.

As trouble is frequently experienced by .reason of the gradual working loose of it has proved in practice in the majority of cases a difficult operation to make a good joint by the usual methods of soldering,

owing to generally unfavorable locations and conditions encountered in making ground connections, I have overcome this dificulty most eifectually by producing a device that is substantially self-soldering by the -mere application of lheat after the partsare joined and in place.

To accomplish this I employ a relatively broad band of metal, preferably copper by reason of its high heat conductivity.v This band,'l, is impressed with a channel, or channels 2, 12, and a furrow, 3, adapted to receive the wire, 10, .from the circuit. A hole, e, to receive a bolt, 5, is made in the band adjacent to the furrow 3, and several holes, 6, are likewise punched in the band to facilitate Vits ready adjustment vto various sized7 conductors, by use of the bolt 5 and nut The channel 2, is adapted to contain a4 supply of solder Sready to be fused.Y In Fig. 5 this channel is shown with branches, 12, to increase distribution when desired. These channels may be partially or completely filled fiush as shown in Fig. 1 with solid solder 8 before installation according to the character of the conductor to be employed and the nature of desired joint. In some cases it may be preferable to have the solder deposit, extendvbeyond the plane of the contacting surface of the band, l, as shown in Fig. 4, so that while the solder is fused the band may be further tightened on the conductor 'and lthus spread and squeeze the solder into very intimate contact with both band and conductor. Where the channel intersects the edge of the band, as seen at 11, an orifice is formed, shown in broken line curve, Fig, 3, Athus permitting the introduction of additional solder after clamping when expedient.. Regarding the installation of the solder material my design is that, in one form of the device, it may be applied and secured within the channel at the'time of manufacture; or, in the form of wire, rod or tape, it maybe furnished loose with the clamp, to be distributed in y the quantity and form v desired bythe user at the time of application of the`joint. -In either 4case the result is the same, i. c. the

solder in a solid state will be retained within the channel 2 adjacent to the conductor 9 when the band 1 is applied to the conductor and the nut screwed in place.

It will be observed that thev channel 2 leads to and communicates with the furrow 3 which holds the circuit wire 10. The object vof this -is to provide a ready means of flow about it sothat the solder lies between thel two; The bolt 5 is then inserted through the appropriate hole 6 and the hole 4, the nut applied, the band adjusted to its exact posi tion, and the bolt and nut tightened up so as to hold the parts well and snug. Flux is then applied to the curve 3 and the wire to be grounded inserted, the furrow being closed about the wire to retain it. The torch is then brought into use and the flame directed to the band and carried back and forth longitudinally until the solder flows freely and reachesV the desired locations on the conductor and into the furrow 3 around the wire l0. An extremely fine, tight joint can Vbe made by further tightening the nut andwbolt while the flame: is being applied whereby advantage is talljen of the temporaryV expansion of the band due to the heat followed bythe contraction due to cooling. By intelligent use of the torch, thus, in combination with accompanying adjustments of the nut and bolt, the solder may be controlled so as to iow exactly as desired and a veryelegant connection, electrically and rnechanically, secured.

I am aware that prior to my invention ground clamps have been made with bands having holes and secured about a conductor by abo-lt and nut. YI therefore do not claim such a combination broadly; but

I claim: e l

lfIn a device of the character described, in combination, a band, a 'deposit of solder lodged therein, means to direct the flow of said solder when fused and means for holdto retain solid solder, channels therein to direct the flow of said solder when fused and means for holding said band about a conductor.

4. In a device 'of the character described, in combination, a band, a receptacle therein to retain solid solder, a furrow shaped said band adapted to Vreceive a wire, a channel in said band leading to said curve and means for clamping said band about a conductor. v 5. In a. device of the character described, in combination, a band, a solder receptacle therein, wire retaining furrow therein, channels therein adapted to direct the flow of molten solder,'one thereof leading to said curve and means for clamping said Vband about a conductor. i

6. In a devicefof the character described, in combinatiomfa band, a solder holding formation therein, a wire retaining furrow therein, channels thereinf'yadapted, when said band is held around a conductor, to direct molten solder into Contact with said conductor and with a wire within saidr furrow, an orifice to said channels adapted to admit solder and flux and means to hold said band about a conductor, all substantially as and Vfor the purposes described.

In testimony whereof I have signed my name to this specification in the presence of two subscribing witnesses, this 8th day of May, A. D. 1915.

JAMES ELBERT BIRDSALL. Witnesses:

AUGUSTINE C. METZINGER,

L. T. MARTIN.

Copies of thispatent may be obtained for five cents each, by addressing the Commissioner of Patents,

Washington, D. C. i

in combination, a band, a receptacle therein A 

